Agile Manufacturing of Glass Carriers for Advanced Packaging

SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus. We also talked about the impact of this work on in-process warp control, as well as the associated production methodology that provides rapid prototyping and high-volume manufacturing. We spoke ahead of his presentation at the 3D & Systems Summit, 28-30 January, 2019, in Dresden, Germany. To register for the event, please click here.