SARATOGA SPRINGS, New York — May 6, 2019 — Celebrating its 30th anniversary, the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2019) kicks off today with more than 300 industry experts and executives delivering more than 30 hours of technical presentations on the latest advanced manufacturing strategies and methodologies. May 6-9, 2019, in Saratoga Springs, New York, ASMC 2019 is the leading international technical conference for improving the collective manufacturing expertise of the semiconductor industry. ASMC 2019 registration remains open.
Cutting-edge technologies such as artificial intelligence (AI), Internet of Things (IoT), 5G and machine learning are dramatically increasing demands on semiconductor manufacturing. Device makers, equipment and materials suppliers, and academics must respond by collaborating to develop new solutions. Technical presentations at ASMC highlight industry innovations with specific results and are published by IEEE, with select manuscripts republished in the ASMC Special Section of IEEE Transactions on Semiconductor Manufacturing.
Part of the SEMI Technology Leadership Series of the Americas, ASMC 2019 features a panel discussion titled Time to Yield vs. Time to Productivity: What Matters Most in the Age of More than Moore? with experts from Applied Materials, Axcelis, GLOBALFOUNDRIES, SkyWater Technology and TechSearch International.
ASMC 2019 Keynotes
Robert Czetina, Infineon Technologies Austria
Christine Dunbar, GLOBALFOUNDRIES
Robert Maire, Semiconductor Advisors
ASMC 2019 technical sessions include:
- Advanced Metrology
- Advanced Process Improvement
- Advanced Materials and Photonics
- Advanced Process Control
- Contamination Free Manufacturing
- Defect Inspection
- Factory Optimization
- Materials Integration and Photonics
- Yield Management
ASMC 2019 also provides powerful networking opportunities including an interactive poster session (including student presentations) and receptions.
The conference is co-chaired by Chris Ebert of Linde and Dr. Franz Heider of Infineon Technologies Austria.
Back by popular demand, the third year of Women in Semiconductors program – held May 6 in conjunction with ASMC 2019 – will underscore the critical importance of workplace diversity as the global semiconductor industry works to grow its talent pipeline. Registration is complimentary for ASMC attendees. Ellie Yieh, corporate vice president for Advanced Product Technology Development at Applied Materials, will keynote.
ASMC 2019 is presented by SEMI with technical sponsors including Institute of Electrical & Electronics Engineers (IEEE), IEEE Electron Devices Society (EDS), and IEEE Electrons Packaging Society (EPS). Corporate sponsors include Applied Seals, Edwards, GreeneTweed, Inficon, KLA and NOVA.
For conference details, contact Margaret Kindling from SEMI at email@example.com or 1.202.393.5552. Qualified members of the media should contact Scott Stevens for SEMI Americas at firstname.lastname@example.org for media registration information.
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Scott Stevens/SEMI Americas