ASMC 2019 - Session 14

Thursday, May 9

Session 14 – Defect Inspection / Yield Methodologies

Chairs: Ankit Jain, KLA-Tencor; Reshmi Mitra, Samsung Austin Semiconductor
Process characterization and defect inspection techniques are critical for successful semiconductor manufacturing Defect inspection and yield enhancement This session will present techniques and applications for process diagnostics and control, as well as yield monitoring.

14.1 What’s in Space – Exploration and Improvement of Line/Space Defect Inspection of Fine-Pitch Redistribution Layer for Fan-Out Wafer Level Packaging
M. Liebens, J. Slabbekoorn, A. Miller, E. Beyne, imec; M. Stoerring, R. Yeoh, A. Vangal, S. Hiebert, A. Cross, KLA-Tencor

14.2 a-Si Pinhole Detection and Characterization using Haze Monitoring
Asli Sirman, Fuad Al-Amoody, GLOBALFOUNDRIES; Chandar Palamadai, Barry Saville, Ankit Jain, Kha Tran, KLA-Tencor 

14.3 Distinguishing Between Electron-beam Signals in Probing of SRAM modules for Yield Management
Gregory M. Johnson, Andreas Rummel, Matthias Kemmler, Ted Lundquist, Baohua Niu, Carl Zeiss

14.4 Elimination of Polysilicon Residues Formation Induced by Watermark on Hydrophobic Surface
Ke Kian Seng Joseph, Deyline Samail, Infineon Technologies (Kulim)