ASMC 2019 - Session 3

Tuesday, May 7

Session 3 – Defect Inspection I

Chairs: Felix Levitov, Applied Materials, Oliver Patterson, Hermes-Microvision, Abhishek Vikram, Anchor Semiconductor
Inline defect inspection continues to enable process control and yield improvement. This session will present techniques and applications for yield enhancement in a high-volume manufacturing environment. 

1:30 
3.1   Copper Bridge Defects with Wafer Center Signature Induced by Litho Rework Process
Wei Xia, Minhwa Jacoby, Henry Andagana, Matthew Gilliland, Samsung Austin Semiconductor

1:55
3.2   Integration of Computer-Aided Design (CAD) Information into a Defect-Review SEM Platform and Design Based Automatic Defect Classification
Jay Shah, Teresa A. Esposito, Abhinav Jain, Felix Levitov, Applied Materials; John G. Sheridan, Shashi Shekhar, Shi-Hui Jen, Victor Aristov, Hoang Nguyen, GLOBALFOUNDRIES

2:20
3.3   Inline Inspection Improvement using Machine Learning on Broadband Plasma Inspector in an Advanced Foundry Fab 
SM Guo, JX Liu, Taiwan Semiconductor Manufacturing Company; Rupesh Navalakhe, Andy Lee, Mahatma Lin, Martin Plihal, Jianyun Zhou, KLA-Tencor

2:45
3.4   Electron Beam Inspection: Within Die and Within-Wafer monitoring of RMG CMP 
Richard F. Hafer, Hong Lin, GLOBALFOUNDRIES; Brian Yueh-Ling Hsieh, Hermes Microvision

3:10
3.5   High-Throughput, Nondestructive Assessment of Defects in Patterned Epitaxial Films on Silicon by Machine Learning-Enabled Broadband Plasma Optical Measurements
Shravan Matham, Curtis Durfee, Brock Mendoza, Devendra K Sadana, Stephen W Bedell, John Gaudiello, Sean Teehan, IBM Research; HeungSoo Choi, Ankit Jain, Martin Plihal, KLA-Tencor 

3:35   Networking Break