ASMC 2019 - Session 5

Tuesday, May 7

Session 5 - Poster Session / Student Posters (sponsored by KLA)
5:15pm - 6:45pm

Chairs:  Rajan Beera, Pall; Jeanne Bickford, Ph.D; Thanas Budri, Texas Instruments; Saurabh Chowdhury, Transphorm USA; Nora Colligan, Samsung Austin Semiconductor; Ronny Haupt, Nova Measuring; Pratik Joshi, Samsung Austin Semiconductor; Sagar Kekare, KLA; Sophia Keil, University of Applied Sciences Zittau; Rama Krishna, Analog Devices,; George Kong, Peregrine Semiconductor; Chris Long, IBM; Katie Lutker, TEL; Holly Magoon, Nikon Precision; Jay Mody, GLOBALFOUNDRIES; Mohammad Nosrati, Watlow; Chandar Palamadai, KLA; Thomas Phely-Bobin, Entegris; Dieter Rathei, DR Yield; Terry Spooner, GLOBALFOUNDRIES; Bradley Wood, Entegris; Qintao Zhang, Applied Materials

40nm Donut Scan Failed Induced by Active Drain/Source Stress Issue
Low Wen Bin, James Lai Chien Hsin, Sung Liang Chun, GLOBALFOUNDRIES

Addressing Process Control Challenges in Big-and-Wide Data Environments
Mike Alperin, Thomas Hill, Steven Hillion, David Katz, TIBCO Software

Application of Residual Gas Analyzer(RGA) for Particle and Cost Reduction in ALD Oxide
Rouzbeh Jani, Surya Rajendran, Shrikant Kashibhatla, Samsung Austin Semiconductor

The Benefits of Multi-Stage Filtration for Improved CMP Slurry Large Particle Retention
Allison Hsu, Bob Shie, Bradley Wood, Entegris

Capturing Tool Availability in the Capacity Model based on Actual Utilization
Vikram Arjunwadkar, Nivedha Rajasekaran, GLOBALFOUNDRIES

Carbonized Polymer Nanostructues for Biosensing
Mohammad Aminul Haque, Nicole McFarlane, The University of Tennessee, Knoxville; Nickolay V.  Lavrik, Dale Hensley, Oak Ridge National Laboratory

Complementary Metrology Techniques to Detect Low Levels of Metallic Contaminations on Raw Silicon Wafers
Violette Lamoureux, Thomas Vitrani, Nicolas Pic, Julien Martinez And François Figarols, STMicroelectronics

Controlling TC SAW Filter Frequency with Picosecond Ultrasonics                                      
SU Kim, DS Kim, KU Lee, Wisol; KS Parka, YT Hana, C Kima, J. Daib, P. Mukundhan, Rudolph Technologies

Decentralized Network for Next Generation Sensor Integration and Edge Computing
Joel Warner, Kelly Orgeron, Samsung Austin Semiconductor

A Deep Learning Model for Identification of Defect Patterns in Semiconductor Wafer Map
Yaun Fu Yang, Taiwan Semiconductor Manufacturing Company

Electrostatic discharge prevention in ultra-pure water spray cleaning aimed at CFM
Yoshiyuki Seike, Takanari Ogawa, Yusuke Ishida, Yoshinori Kobayashi, Taishi Segawa, Keiji Miyachi, Tatsuo Mori, Aichi Institute of Technology

The Etching of Silicon Nitride in Phosphoric Acid with Novel Single Wafer
Verna Chang Chien, Chi-Ming Yang, Taiwan Semiconductor Manufacturing Company; Chi-Chang Hu, National Tsing-Hua University

Evaluation of Surface Modification Treatment for High Aspect Ratio Patterns for Sub 7nm FinFET Technology Nodes
Sridhar Kuchibhatla, A. Kadiyala, GLOBALFOUNDRIES; L. Chang, M. Packiam, I. Brown, T. Emoto, T. Iwata, Vincent Sih,SCREEN  

Fast and Accurate Defect Classification for CMP Process Monitoring
Yong-Yi Lin, Fu-Shou Tsai, Li-Chieh Hsu, Hsin-Kuo Hsu, Chih-Yueh, Li, Yu-Yuan Ke, Chih-Wei Huang, Jun-Ming Chen, United Microelectronics Corporation; Shao-Ju Chang, Tung-Ying Lee, Ethan Chen, Chao-Yu Cheng, Joe Chen, KLA

Harmonic Analysis of Wafer Fabrication Data in the Frequency Domain
Taikang Ning, Trinity College; CH Huang, J. Jensen, H. Chan, V. Wong, Lam Research

Impact of Sacrificial Hard Mask Material in BEOL Integration in Advanced Technology
Eswar Ramanathan, Lei Jiang, Qanit Takmeel, Silvestre MaryClaire, AnbuSelvam KM Mahalingam, Somnath Ghosh, Keith Donegan, Ashwini Chandrasekar, Sunil Singh, Henrik Johanson, Daniel Damjanovic, ZhiGuo Sun, Anirvan Sircar, Sang-Kee Eah, Colin Bombardier, Adam DaSilva, Brendan O'Brien, Alycia Roux, Brett Cucci, Ordonio Christopher, Christa Montgomery, Vandana Venkatasubramanian, Vijaya Rana, Jay Mody, Joseph Shepard Jr., Craig Child, Bradley Morganfeld, Rebekah Sheraw, GLOBALFOUNDRIES

Inline Defect control for automotive Memory Devices in IC manufacturing
Chen-Men Lin and Yun-Chung Tung, Winbond Electronics; Shufen Lin, Steve Lin, Alex Cheng, KLA

Line Edge Roughness due to Oxide Rie Process
Michael Steigerwalt, David Urrabazo, Robert Baiocco, Ryan Kelly, Allen Minns, Derek Dechamplain, Qifang Qiao, Raymond Van Roijen, GLOBALFOUNDRIES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Machine Learning Approaches for Nuisance Filtering in In-line Defect Inspection
SangHyun Lee, Ankit Jain, Martin Plihal, Saravanan Paramasivam, Tai-Kam Ng, Erfan Soltanmohammadi, KLA-Tencor; Ian Tolle, Dave Salvador, Hoang Nguyen, Dorothee O'Toole, GLOBALFOUNDRIES

Machine Learning for Optimized Scheduling in Complex Semiconductor Equipment 
Doug Suerich, Terry Young, PEER Group Inc.

Machine Learning Inside the Cell to Solve Complex FinFET Defect Mechanisms with Volume Scan Diagnosis 
Huaxing Tang, Manish Sharma, Wu-Tung Cheng, Gaurav Veda, Doug Gehringer, Matt Knowles, Mentor, A Siemens Business; Kannan Sekar, Neerja Bawaskar, GLOBALFOUNDRIES

Mid-low Energy Implantation Tilt Angle Monitoring with Photomodulated Reflectance Measurement 
Á. Kun, J. Szívós, E. Kis, R. Piros. O. Almásy, Sz. Spindler T. Szarvas, A. Pongrácz, Gy. Nádudvari, J. Byrnes, F. Ujhelyi, Semilab; Leonard M. Rubin, Axcelis Technologies

Novel Method to Address Wafer Surface Condition
Satyajit Shinde, Lawrence Mbonu, Halima Ali, Jea Sung Park, Xiao Chen, Samsung Austin Semiconductor

Novel Oxygen-based Dry Strip Process Reducing NOx Emissions During Photoresist Removal 
Ji Seung Kim, Je Hyeok Ryu, Chiyoung Lee, Yun Young Lee, Byoung Hoon Ki, PSK Inc.

Operation Based Recipe Management System on SEMI E170 (SFORMS)
Osamu Ohishi, IBM Services Japan Co., Ltd.; Shoichi Harakawa, Toshiba Memory Corporation​

Optimization of Metal Photo Rework Dry Strip Scheme for Yield Improvement 
Sidhant Grover, Philip Thompson, SkyWater Technology 

Photoresist Lifting Induced Oxide Bridge Defects
Wei Xia, David Anderson Dip Mahato, Felix Lin, Jonathan Cohrs, Shazad Paracha, Eric Ellis, Samsung Austin Semiconductor

Rapid In-line Process Window Characterization Using Voltage Contrast Test Structures for Advanced FinFET Technology Development
Weihong Gao, Jeonghee Kim, Hsiao-Chi Peng, Chih-Chung Huang, GLOBALFOUNDRIES; Oliver D. Patterson, Yu-Chi Su, Hsiang-Ting Yeh, Haokun Hu, ASML

A Robust Multi-Stage Scheduling Approach for Semiconductor Manufacturing Production Areas with Time Constraints 
Christian Maleck, Gottfried Nieke, Karlheinz Bock, Technische Universität Dresden; Detlef Pabst, Meinhard Schulze, Marcel Stehli, GLOBALFOUNDRIES

Scanning Frequency Comb Microscopy (SFCM) Shows Promise for Carrier Profiling at and Below the 7-nm Node 
Mark Hagmann, NewPath Research L.L.C.; Jeremy Wiedemeier, University of Utah

Sensitivity Enhancement by Enabling Design-Based Inspection for DRAM
Y.M. Lu; J.W. Huang; Kevin Hsiao, Nanya Technology; Joe Chen; Alex Cheng, KLA

Single Particle Inductively​ Coupled Plasma Mass Spectrometry Metrology for Advanced Semiconductor CMP Process Development  
Larry Zazzera, Alexander Simpson, David Muradian, Jaimie Stomberg, Uma Lagudua, 3M Company

The Study on Critical Dimension Target Prediction for Etch Process 
Chien-Cheng Wang, Kai-Ting Tseng, Chia-Jui Chuang, Richard, S.J. Chen, Yu-Hang Piao, Taiwan Semiconductor Manufacturing Company

Sub-surface Patterns on a 3D chip investigated by Terahertz nanometrology 
Anis Rahman, Aunik Rahman, Applied Research & Photonics

Temperature Profile Analysis of Diffusion Furnace Silicon Nitride Deposited Film
Satyajit Shinde, Lawrence Mbonu, Xiao Chen, Samsung Austin Semiconductor

Throughput Optimization of Fast Processing Tools Using a Dispatching Algorithm 
Shiladitya Chakravorty, Atirek Wribhu, GLOBALFOUNDRIES

Wave Front Phase Imaging of Wafer Warpage and Wafer Geometry 
Juan Trujillo, Jose Manuel Ramos Rodrigues, Juan Trujillo, Jan Gaudestad, Wooptix

Yield Improvement Using Advanced Data Analytics 
William Henning, Neeta Basantkumar, James Oliver, Armando Anaya, Northrop Grumman

 

Student posters:

FeFET Fabrication and Characterization at RIT
Jordan Merkel (Advisors: Profs. Kurinec, Pearson), Rochester Institute of Technology

Fabrication of AlGaN/GaN High Electron Mobility Transistors
Vijay Gopal Thirupakuzi Vangipuram (Advisors: Profs. Zhang, Hartensveld), Rochester Institute of Technology

Nanowire LED Displays
Matthew Hartensveld, Rochester Institute of Technology