ASMC 2019 - Session 7

Wednesday, May 8

Session 7 - Advanced Metrology II

Chairs:  Delphine LeCunff, STMicroelectronics; Matt Sendelbach, Nova Measuring Instruments; Alok Vaid, GLOBALFOUNDRIES
This session contains presentations from a variety of techniques, including ebeam metrology, ultrasonics metrology, Atomic Force Microscopy, and optical metrology.  The techniques are used to characterize device materials and measure parameters such as roughness and stress.

7.1   Extension of CD-TEM towards EDS Tomography
Frieder H. Baumann, Brian Popielarski, GLOBALFOUNDRIES; Yinggang Lu, Thermo Fisher Scientific

7.2 Simultaneous Denoising and Edge Estimation from SEM Images Using Deep Convolutional Neural Networks (Student paper)
Narendra Chaudhary, Serap A. Savari, Texas A&M University

7.3 Acoustic Metrology for Fine Pitch Microbumps in 3DIC 
M. Mehendale, J. Chen, J. Dai, R. Mair, M. Kotelyanskii, P. Mukundhan, Rudolph Technologies

7.4 AFM Surface Roughness and Depth Measurement of Trenches with High Aspect Ratio
Franz Heider, Helfried Schwarzfurtner, Infineon Technologies Austria; Sang-Joon Cho, Park Systems; Thomas Trenkler, Infineon Technologies Dresden

7.5 Full Wafer Stress Metrology for Dielectric Film Characterization: Use Case
V.Brouzet, V.Gredy, F.Chenevas-Paule, K.Le-Chao, A.Laurent and D.Le-Cunff, STMicroelectronics

11:30  Boxed Lunch