ASMC 2019 - Session 7

Wednesday, May 8

Session 7 - Advanced Metrology II

Chairs:  Delphine LeCunff, STMicroelectronics; Matt Sendelbach, Nova Measuring Instruments; Alok Vaid, GLOBALFOUNDRIES
This session contains presentations from a variety of techniques, including ebeam metrology, ultrasonics metrology, Atomic Force Microscopy, and optical metrology.  The techniques are used to characterize device materials and measure parameters such as roughness and stress.

9:20  
7.1   Extension of CD-TEM towards EDS Tomography
Frieder H. Baumann, Brian Popielarski, GLOBALFOUNDRIES; Yinggang Lu, Thermo Fisher Scientific

9:45
7.2 Simultaneous Denoising and Edge Estimation from SEM Images Using Deep Convolutional Neural Networks (Student paper)
Narendra Chaudhary, Serap A. Savari, Texas A&M University

10:10
7.3 Acoustic Metrology for Fine Pitch Microbumps in 3DIC 
M. Mehendale, J. Chen, J. Dai, R. Mair, M. Kotelyanskii, P. Mukundhan, Rudolph Technologies

10:35
7.4 AFM Surface Roughness and Depth Measurement of Trenches with High Aspect Ratio
Franz Heider, Helfried Schwarzfurtner, Infineon Technologies Austria; Sang-Joon Cho, Park Systems; Thomas Trenkler, Infineon Technologies Dresden

11:00 
7.5 Full Wafer Stress Metrology for Dielectric Film Characterization: Use Case
V.Brouzet, V.Gredy, F.Chenevas-Paule, K.Le-Chao, A.Laurent and D.Le-Cunff, STMicroelectronics

11:30  Boxed Lunch