ASMC 2019 - Session 8

Wednesday, May 8

Session 8 - Defect Inspection II

Chairs: Jennifer Braggin, Entegris; Israel Ne'eman, Applied Materials
Inline defect inspection continues to enable process control and yield improvement. This session will present techniques for process characterization and defect reduction. 

12:25  
8.1  Mask Qualification of a Shifted Gate Contact Issue by Physical E-beam Inspection and High Landing Energy SEM Review
John G. Sheridan, Hsiao-Chi Peng, Chih-Chung Huang, Victor Aristov, Hoang Nguyen, GLOBALFOUNDRIES; Yashdeep Khopkar, Abhinav Jain, Jay Shah, Felix Levitov, Applied Materials  

12:50
8.2 Criticality of Photo Track Monitoring for Lithography Defect Control
Nathaniel Mowell, Brian Sheumaker, Timothy Han, Joe Chaung, Shail Sanghavi, Yashdeep Khopkar, Felix Levitov, Applied Materials; Brandon Bielec, Dave Salvador, Kareem Naguib, Vu Nguyen, GLOBALFOUNDRIES  

1:15
8.3 Utilizing Single Scan and Enhanced Design-Based Binning Methodologies for Improved Process Window Assessment and Hot Spot Discovery 
Alexa Greer, Abhinav Mathur, Ankit Jain, KLA; Sonal Singh, Qian Xie, Shweta Khokale, Panneerselvam Venkatachalam, GLOBALFOUNDRIES

1:40
8.4 Using High-Speed Video Analysis for Defect Investigation and Process Improvement
Adam Chalupa, Eric Ritschdorff, Samsung Austin Semiconductor

2:05 Networking Break