Glossary of Flexible Electronics Terms 

If you are new to Flexible Electronics you are going to run in to unfamilur phrases. We have started this glossary for you. Please reach out to us when you encounter a term on the FlexTech Info Hub we have not defined below and we will add it. 

     AE: AeroMedical Evacuation 
     AFRL: Air Force Research Laboratories
     ANT: A proprietary wireless sensor network technology developed by Dynastream Innovations, Inc.
     API: Application Programming Interface
     ARL: Army Research Laboratories
     ASIC: Application Specific Integrated Chip
     ATM: Air Traffic Management
     BDNF: Brain-Derived Neurotrophic Factor
     BP: Blood Pressure
     C2: Command and Control
     Calcined: 1) Reduce, oxidize, or remove moisture from by roasting or strong heat. 2) Thermal treatment process to bring about thermal decomposition.  High Temp but below melting point 
     CASEVAC: Casualty Evacuation
     CCATT: Critical Care Air Transport Team
     CLIA: Clinical Laboratory Improvement Amendments
     CMOS: Complementary Metal Oxide Semiconductor
     CONOPs: Concept of Operations
     CONUS: Contiguous United States (also Conterminous and/or Continental US)
     COTS: Commercial Off The Shelf
     CPOD: Crew Physiological Observation Device
     CTE: Coefficient of Thermal Expansion
     DFM: Design for Manufacture
     Dielectric: 1) having the property of transmitting electric force without conducting; insulating 2) a medium or substance that transmits electric force without conducting; an insulator. Can be polarized by an applied electric field 
     ECG Sensor:  Electrocardiogram Sensor
     ECG: Electrocardiogram
     EEG: Electroencephalography
     Egress: is the passage of (material, signal, matter) intended to remain within into the outside 
     EMG: Electromyography
     EPD: Electrophoretic Ink Display 
     EPHI: Electronic Protected Health Information
     EQE: External Quantum Efficiency
     FDC: Flexible Display Center (at Arizona State University)
     Flexible Electronics:   generally refers to a class of electronic devices built on conformable or stretchable substrates, usually plastic, but also metal foil, paper and flex glass. Includes Flexible Hybrid Electronics and Printed Electronics. 
     Flexible Hybrid Electronics:  printed electronics combined with silicon-based integrated (active) circuits on a conformable substrate.  Examples of key active components from Si CMOS processes include microcontrollers, digital signal processors, high density memories and RF chips
     Flexography: (often abbreviated to flexo) is a form of printing process which utilizes a flexible relief plate. 
     Flip Chip: a computer chip that is installed face-down
     FPC: Flexible printed circuit
     FPE: Flexible and Printed Electronics
     GW: General Ward
     hCG: Human Chorionic Gonadotropin
     HIPAA: Health Insurance Portability and Accountability Act
     HIS: Human Systems Integration
     HPA: Human Performance Augmentation
     HR: Heart Rate
     HRV: Heart Rate Variability
     HSP: Heat Shock Protein
     ICU: Intensive Care Unit
     HPM: Human Performance Monitoring
     In site: In Position; In its original place 
     Ingress: is the passage of an outside (material, signal, matter) inside
     Interposter: Electrical interface routing between one socket or connection to another. The purpose is to spread a connection to a wider pitch or reroute a connection “to put up between” 
     IP: Internet Protocol
     ISF: Interstitial Fluid
     ISR: Intelligence, Surveillance, and Reconnaissance
     IVD: In-Vitro Diagnostic
     LCD: Liquid Crystal Diode
     LFA: Lateral Flow Assay
     LOC: Lab On a Chip
     LPM: Low Pressure Molding 
     LT Soldering: Low Temperature Soldering
     LTPS: Low Temperature Polycrystalline Silicon
     MET: Metabolic Equivalent
     MILSPEC: Military Specification
     MOPP: Mission Oriented Protective Posture
     MRL: Manufacturing Readiness Level
     mTBI: Mild Traumatic Brain Injury
     MURI: Multi-University Research Initiative
     NIBP: Non-Invasive Blood Pressure
     NVG: Night Vision Goggles
     OLED: Organic Light Emitting Diode
     OpAmp: An operational amplifier (often op-amp or opamp) is a DC-coupled high-gain electronic voltage amplifier with a differential input and, usually, a single-ended output.
     Organic Electronics:  a field of material science concerning the design, synthesis, characterization, and application of organic small molecules or polymers that show desirable electronic properties such as conductivity.  Some freely substitute this term with plastic electronics.
     O-TFT: Organic Thin Film Transistor
     PAN: Personal Area Network
     pCO2: Carbon dioxide partial pressure
     PDMA: Poly(dodecylmethacrylate)
     PDMS: Polydimethylsiloxane
     PEN: Polyethylene naphthalate
     PET: Polyethylene terephthalate is the most common thermoplastic polymer resin of the polyester family. Used as a substrate 
     Photolithography: "is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate. " Wikipedia Image Explanation
     Plastic Electronics:  generally refers to a class of electronic devices built on plastic (polymer) substrates, as opposed to silicon or glass.
     PMA: Pre-Market Approval
     pO2: Oxygen partial pressure
     POC: Point of Care
     PPG: Photoplethysmograph
     Printed Electronics:  functional electronics fabricated by laying conductive lines using one of several printing methods, including: screen, ink jet, gravure, flexography and others.  Often confused with printed circuit boards, which also often use printing methods to connect discrete active and passive components.
     Printed RFID: Printed Radio Frequency IDentification: technology that incorporates the use of electromagnetic or electrostatic coupling in the radio frequency (RF) portion of the electromagnetic spectrum to uniquely identify an object, animal, or person.
     PSA: Pressure sensitive adhesive
     PTSD: Post-Traumatic Stress Disorder
     PV: Photovoltaics is a term which covers the conversion of light into electricity using semiconducting materials
     PVD: Physical Vapor deposition
     QVGA: Quarter VGA (Video Graphics Array)
     Roll-to-Roll: the process of creating electronic devices on a roll of flexible plastic or metal foil. 
     RPV: Remotely Piloted Vehicle
     RR: Respiratory Rate
     SA: Situational Awareness
     SatCom: Satellite Communications
     Sinter: Make a powdered material coalesce into a solid or porous mass by heating it without liquefaction 
     SpO2: Saturation of Peripheral Oxygen / Pulse Oximeter Oxygen Saturation
     Sputter Zone: Sputter deposition is a Physical Vapor deposition (PVD) method of thin film deposition. Material is ejected from a source “Target” onto a substrate 
     SS: Stainless Steel
     SWaP: Size Weight and Power
     Thin Film Transistor (TFT): a special kind of field-effect transistor made by depositing thin films of an active semiconductor layer as well as the dielectric layer and metallic contacts over a supporting (but non-conducting) substrate.
     TRL: Technology Readiness Level
     UTCP: Ultra-Thin Chip Packaging
     V: Volt
     WSN: Wireless Sensor Network
     YSZ: Yttria-Stabilized Zirconia is a ceramic used for substrates. ENrG has made a flexible version for flexible electronics called Thin E-Strate®
     μm: Micrometre or Micron is a unit of length equaling 1x10-6 of a metre or one millionth of a metre