Adoption of 3D IC Technology and the Golden Age of Semiconductor
Vice.President, 3D R&D, Xperi
We are entering the Golden Age of Semiconductor where the traditional approach to technology advancement being able to meet next generation application requirements that has served us well for decades is becoming increasingly challenged to deliver on future application requirements. For example Moore’s Law, which along with the National Technology Roadmap for Semiconductors and International Technology Roadmap for Semiconductors (ITRS) have successfully predicted and guided integrated circuit (IC) scaling and its dominance of semiconductor industrial growth for over 50 years, Is no longer able to provide a simple prediction of how we will succeed in meeting our future challenges. This has become increasingly apparent over the last few years as evidenced by calls for “More than Moore”, dissolution of the ITRS and formation of the Heterogeneous Integration Roadmap.
Three dimensional (3D) IC fabrication technology promises to play an enabling role in meeting our future application requirements, including continued increases in performance and cost reduction in semiconductor manufacturing, as evidenced by remarkable early adopter success in recent years. This presentation will provide an overview of 3D IC technology, examples of early adopter success, and expectations for continued adoption to help us meet our future challenges.