Paul Enquist, PhD
Vice President of 3D R&D, Xperi
Dr. Enquist is V.P. of 3D R&D at Xperi. He has over 30 years of experience, over 130 publications and presentations and over 50 issued US patents related to high speed devices and circuits, low temperture direct bonding and 3D integration. He holds Ph.D. and M.S. degrees in Electrical Engineering from Cornell University and a B.S. degree in Engineering from Columbia University. He is an IEEE senior member, member of Tau Beta Pi and Eta Kappa Nu.