Melissa Grupen-Shemansky, PhD
Chief Technology Officer, Flexible Electronics & Advanced Packaging
Dr. Grupen-Shemansky is the Chief Technology Officer at SEMI for flexible electronics and advanced packaging. She leads R&D consortia and the FlexTech governing and technical councils.
Melissa has over 25 years of experience in the semiconductor industry at various levels of management in research and development, manufacturing, business development, and technology strategy. Melissa began her career at Motorola, Semiconductor Products Sector and subsequently worked at Lucent, Bell Labs as Director of Interconnect and Design, and AMD/Spansion as Vice President of Packaging and Interconnect Technology. Prior to joining SEMI, Dr. Grupen-Shemansky was the Senior Vice President of Engineering for Advanced Nanotechnology Solutions, Inc, a startup in 3D ICs and cybersecurity.
Dr. Grupen-Shemansky holds both bachelor’s and master’s degrees in Chemical Engineering from Pennsylvania State University and a Ph.D. in Chemical Engineering from Arizona State University. She has received various corporate and educational awards, has seven issued patents, numerous technical publications, and is a contributing author to Failure-Free Integrated Circuit Packages.