BOE Technology Group Co., Ltd

BOE Technology Group Co., Ltd

Street Address: 
北京市朝阳区酒仙桥路10号
北京
China
100016
Web Site Address: 
Company Description: 

Ultra-thin Metal-bond Dicing Blade used in Ceramics, Sapphaire, optical, galss,csp, quartzs

Resin Bond Blade used in QFN, optical galss, ceramic materials

Nickel Diamond hub and hubless blades used in PCB. BGA, Silicon wafer, ceramic sub strate materials.

Metal-bond / vitrified-bond / grivding wheels are used in Silicon wafers, Sapphaire epitaxial wafer, Gan wafer

Company ID: 
148026
Join Date: 
Mar 2, 2012
Address Map: 
Primary Industry: 
Display/Flat Panel Display
Primary Product Category: 
Device Manufacturing
Primary Product Sub Category: 
LCD Displays