Capcon Limited Co., Ltd

Capcon Limited Co., Ltd

Street Address: 
Room 206B-4, 2nd Floor, Tower 1, Harbour Center
1 Hok Cheung Street, Hung Hom
Hong Kong
Hong Kong
999077
Web Site Address: 
Company Description: 

为先进半导体封装提供技术和解决方案的设备这招是,针对半导体后道工序提供全新一代半导体装嵌及封装设备,如高精度高产能半导体先进封装设备(Die Bonder)、倒装先进封装设备(Flip-Chip Bonder),晶圆级先进封装设备(Chip-on-Wafer Bonder),叠词先进封装设备(Stack Die Bonder)以及面板级先进封装设备(Large Panel Bonder)等。公司拥有多项自主创新的技术专利,产品得到全球最知名的半导体封测厂商的认可。
A leading company to provide innovative solutions for semiconductor advanced packaging industry and electronics manufacturing service industry. The company satisfies its customers with innovative products such as high precision high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer, Stack Die Bonder, Large Panel Bonder and so on to tremendously increase cunstomer's Total Cost of Ownership. The company has a number of international intellectual properties. The products have been tested and recognized by the world's most well-know semiconductro packaging manufacturers.

Company ID: 
268490
Join Date: 
Sep 4, 2018
Address Map: 
Primary Industry: 
Display/Flat Panel Display