SEMI® China Semiconductor Packaging Market Outlook, 2018 edition

SEMI® China Semiconductor Packaging Market Outlook

A comprehensive study that examines the semiconductor packaging market in China

Publication Date: May 2018
Principal Analyst: Shanshan Du, senior analyst, Industry Research & Consulting, SEMI China
Number of pages: 30+ pages
Format: Microsoft® Excel® file (.xls) and Adobe® .pdf

The China Semiconductor Packaging Market Outlook examines market forces impacting the packaging market in China, including the impact of domestic policy on the industry. The report details and provides an outlook for the packaging industry in China, as well as packaging and assembly materials and equipment suppliers. The report also features a database of over 145 packaging facilities located in China with recent activities including latest advanced packaging developments, websites, location and type of products processed.

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    Product Information

    This 2018 edition of this comprehensive market research study covers but is not limited to:

    • China Semiconductor Packaging Industry Outlook
      • Impact of the global economy on China’s IC industry and packaging market
      • China government’s policy on semiconductor industry and on packaging and testing industry
      • Packaging and testing market size and industry trends in China
      • China key semiconductor packaging and assembly company list and recent activities
      • Advanced packaging developments in China
      • Key domestic discrete packaging companies (New in this edition!)
      • Key domestic LED packaging companies (New in this edition!)
    • China Semiconductor Packaging Materials
      • Key packaging materials suppliers in China
      • Leadframe market in China
      • Substrate market in China
      • Mold Compound market in China
      • Bonding wire market in China
    • China Semiconductor Packaging Equipment
      • Semiconductor packaging equipment market overview
      • China manufactured packaging equipment suppliers


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    In-person interviews with materials suppliers, packaging subcontractors and semiconductor manufacturers around the world are the sources of information for this study. Market size information is developed through primary research and modeling. Five-year market forecasts are developed based on different scenarios of new technology penetration and market growth.


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