MILPITAS, Calif. — April 23, 2019 — North America-based manufacturers of semiconductor equipment posted $1.83 billion in billings worldwide in March 2019 (three-month average basis), according to the March Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.9 percent lower than the final February 2019 level of $1.87 billion, and is 24.6 percent lower than the March 2018 billings level of $2.43 billion.
“March billings of North American test and assembly equipment manufacturers showed modest improvement over the prior month,” said Terry Tsao, chief marketing officer of SEMI. “Despite the increase for this segment, overall billings growth expectations for North American semiconductor equipment suppliers appear to be muted for the rest of the year.”
The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
February 2019 (final)
Source: SEMI (www.semi.org), April 2019
SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Next SEMI Billings report is May 21, 2019 at 3:00pm Pacific
For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp