SEMI integrated Packaging, Assembly, and Testing Group

The SEMI integrated Packaging, Assembly, and Testing (SiPAT) Technology Community represents SEMI members who have semiconductor packaging, assembly, or test manufacturing and/or design capabilities and capacities in semiconductor or related industries.

Featured Event

Sept 5-7
Nov 13-16

Featured News and Articles

• Semi-Annual European SiPAT Member F2F Meeting on June 21, 2017, 9am-12pm (Berlin, Germany)
•  Advanced Packaging Market Data from Yole Développement (January 2017)
• What the Heterogeneous Integration Technology Roadmap Will Mean for 2017 (3DInCites; Jan 11, 2017)
• Enabling Next-Generation Packaing, Assembly& Test Technologies, and Manufacturing through Collaboration (Nov 15th, 2016)
• European Chapter of SiPAT f2f meeting took place at SEMICON Europa 2016 (Grenoble, France) on October 26, 2016
• Packaging Wars Begin - OSATs and foundries begin to ramp offerings and investments in preparation for mainstream multi-chip architectures
• SEMI launches new Integrated Packaging Assembly and Test Group (Feb 9th, 2016)

Information on Heterogeneous Integration Roadmap

About SiPAT

• About SiPAT
• Charter and By-laws
• Membership Listing
• European Chapter Organization

Interested in becoming a SiPAT Member?

Contact us for more information at tsalmon@semi.org, or Theresia Fasinski at tfasinski@semi.org