SEMI® Global Update - April 2013
Semiconductor R&D: A State of Transition
Southeast Asia Sees Improving Semiconductor Investment into 2014
Equipment & Materials Market/Outlook
Growing MEMS Markets by Rethinking Manufacturing
Speeding 3D-IC: Update on SEMI Standards
Breakthroughs in LED Packaging Technology
New International PV Technology Roadmap
Computational Lithography: How does it Keep Moore's Law Alive?
EHS White Paper: LSIT and RoHS
SEMI Members Push for Immigration Reform

Event Calendar

April 30
The Convergence of PV Materials, Test and Reliability
April 12
SEMI Arizona Breakfast Forum
April 25
SEMI Silicon Valley Forecast Luncheon
May 1
SEMI Pacific Northwest Breakfast Forum
May 10
Last day: SEMICON West FREE registration
May 13-16
ASMC 2013
May 21
SEMI Texas Spring Forum
May 30
Intellectual Property Protection

- Supply Chain Mgmt
- Financial Boot Camp For Non-Finan Professionals
- Key Semi Acct Selling
- Innovation Management
- CMOS Process Integ
- Transition: 28nm to 22nm Node
- Principles of Selling

May 7-9
SEMICON Singapore 2013
May 24
7th SEMI Brussels Forum
June 5-6
June 19-21
Intersolar Europe 2013

SEMI Award for North America Call for Nominations
Due: Aug 30


Brooks Instruments

Ceramics Industry

Semiconductor R&D: A State of Transition

Karen SavalaSeveral years ago when the challenges to 450mm wafer processing, EUV development and novel transistor designs were first being discussed, SEMI commissioned a study that predicted the industry could face an R&D funding gap that could exceed $9 billion if current technology and economic trends continue. At the time, SEMI issued a statement saying the industry was at a "crossroads" and "without significant attention to the R&D gap, the semiconductor equipment and materials industry will not be able to afford to keep up with Moore's Law."

Much has happened since that report was issued: 450mm development was delayed, but now is ramping at G450C; Intel, Samsung and TSMC have invested over one billion in ASML; cost targets have been missed at 28nm; and 3D-ICs have emerged as an alternative development path for leading-edge chip solutions. But the R&D challenges remain. The industry has responded in unexpected and unique ways, including... (more)

Karen Savala

The New GF135 PTI MFC for Increased Wafer Yield
Brooks Instrument's pressure transient insensitive MFC provides real-time, integrated rate-of-decay flow measurement. It verifies accuracy, checks valve leak-by and monitors sensor drift without stopping production. The result is improved uptime. Read more

Southeast Asia Sees Improving Semiconductor Investment into 2014
By Clark Tseng, SEMI Industry Research & Statistics
The industry started out quite strong in 2012 but declined in the second half of the year. For the SE Asia region, capital equipment investment should pick up in the second half of 2013 followed by a strong recovery in 2014.

2012 Review: Semiconductor Equipment and Materials Market and Outlook
By Lara Chamness, SEMI Industry Research & Statistics
2012 started out quite promising, but ended up with decreased bookings, billings, and shipment activity. Semiconductor revenues declined, along with new equipment and semiconductor materials markets.

Growing MEMS Markets by Rethinking Manufacturing
By Paula Doe, SEMI
Leading MEMS technologists at the Berkeley Sensor and Actuator Center recently argued that enabling big future growth of sensors would require disruptive lower-cost manufacturing technologies.

FREE Annual Subscription for You
EE-Evaluation Engineering provides the latest news, in-depth technical information, and products for electronic test engineers in design, development, and manufacturing. Subscribe today for one free year of the EE print or digital edition.

Speeding 3D-IC to Commercialization: Update on SEMI Standards
By James Amano, SEMI International Standards
The industry is poised to jump from concept to commercialization with 3-D technologies, but multiple manufacturing challenges must be resolved to move forward.

Leading Companies Discuss Breakthroughs in High-Power LED Packaging Technology
By SEMI Taiwan
Advances in high-power LED packaging technology are significant but many challenges such as heat dissipation, materials and structure, still exist-- hindering use of LEDs for many applications.

New Int'l PV Technology Roadmap Updates Path towards Continuous Solar Cost Reduction
The 4th edition of ITRPV is now available, focusing on key technology trends in the field of crystalline silicon (c-Si) photovoltaic technology and identifying critical areas for R&D and process improvements.

SEMICON West 2013

What is Computational Lithography and How does it Keep Moore's Law Alive?
By Paul Werbaneth
Historically, semiconductor device scaling was enabled by the continuous development and implementation of optical lithography innovations.

White Paper: Impact of "LSIT" under EU RoHS
EHS white paper recommends criteria so suppliers of semiconductor and PV manufacturing equipment can determine whether their equipment meets the "large-scale" qualification for Large-Scale Stationary Industrial Tools per the European RoHS Directive.

SEMI Members Urge Obama and Congress to Enact High-Skilled Immigration Reform
More than 100 executives from the technology sector, including SEMI member companies, called on President Obama and Congress to approve legislation this year to reform America's high-skilled immigration system.

ASMC 2013 450mm Central

Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Deborah Geiger
Content Manager, SEMI
3081 Zanker Road, San Jose, California, 95134
Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email:

Subscribe ¦ Unsubscribe

Copyright © 2013 SEMI. All rights reserved.