|SEMI® Global Update - November 2013|
|IN THIS ISSUE|
2nd Call for Papers|
Due: November 14
FROM THE PRESIDENT OF SEMI AMERICAS
Pervasive Computing: Are You Ready?
Pervasive computing is changing the landscape of the microelectronics industry, fragmenting the future of both Moore's Law and More-than-Moore technologies. At the leading edge, we have FinFETs versus FD-SOI; in memory, every roadmap involves novel devices and novel material sets; in 3D stacking, we have foundries, OSATs and IDMs developing alternative paths. In markets, the smart phone and tablet boom is moderating, China and India are cooling, but new markets, such as the all-connected Internet of Things, have the potential to create an entire new ecosystem of buyers, technologies and business models.
Pervasive Computing will be the theme for this year's Industry Strategy Symposium (ISS) held on January 12-14, 2014 in Half Moon Bay, California. You will want to register early to take advantage of discount pricing and ensure yourself a seat and what is sure to be a sold-out event. (more)
Packaging Materials Trends -- Mobility is the Key Market Driver
By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI
The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials. As these trends continue, innovative material solutions will be needed to address demanding requirements related to product integration, mobility, and reliability.
Memory Materials Revolution Highlighted at SMC
By Tom Morrow, SEMI
While the number of materials used in semiconductor logic will increase approximately 50% in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced.
SMC Keynote PPT--Gregg Bartlett, GlobalFoundries
SEMI Members only--15+ SMC Keynotes/PPTs
SEMI Testifies at House Manufacturing Caucus
SEMI testified at the U.S. House of Representatives' Manufacturing Caucus and provided remarks at an October 29 briefing to examine manufacturing innovation in the United States.
Complimentary Webinar: 3D TSV Without Limits
Monday, November 18 / 4pm CET, 3pm GMT
Join us for this informative webinar about 3D TSV technologies, presenting mid to long term perspectives.
3D-IC Standardization Progress Continues
By James Amano, SEMI International Standards
SEMI has two new 3D-IC standards: Guide for CMP and Micro-Bump Processes for Frontside TSV Integration and Guide for Alignment Mark for 3DS-IC Process. Now there are seven published SEMI 3D standards.
450 Central Features 10+ New 450 Presentations
450 Central features 10+ new 450 presentations (including AMAT, CNSE, ENIAC, Fraunhofer, G450C, Intel) from SEMICON Europa plus many 450 articles.
Benedetto Vigna of STMicroelectronics Honored with European SEMI Award 2013
Benedetto Vigna, EVP and GM at STMicroelectronics, was presented with the European SEMI Award 2013 on October 8 during SEMICON Europa 2013.
450mm Update on SEMI Standards--Oct 2013
Thirteen SEMI Standards task forces are working on key 450mm issues. SEMI has 19 450mm standards with 14+ in the pipeline.
Top Executives Gather at SEMICON Japan: Focus on Technologies, Business and the Future
The semiconductor industry and its supply chain are facing technical and business challenges today.
SEMI Forms New Working Group -- Focus on Semi Components, Instruments, and Subsystems
Representatives from SEMI member companies met and formed a Special Interest Group focused on common issues of components, instruments, and subsystem companies.
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