SEMI® Global Update - November 2013
SEMI Global Update
Pervasive Computing: Are You Ready?
Packaging Materials Trends -- Mobility is the Key Market Driver
Memory Materials Revol. Highlighted at SMC
SEMI Testifies at House Manufacturing Caucus
3D-IC Standardization Progress Continues
450 Central Features 10+ New 450 PPTs from SEMICON Europa
Vigna of STMicroelectronics Honored
450mm Update on SEMI Standards-- Oct 2013
Top Executives Gather at SEMICON Japan
New Components, Instruments, & Subsystems Work Group

Event Calendar

November 18
Webinar: 3D TSV without limits
November 6-7
CAST Workshop: Implementing Adaptive Test
November 10-13
Int'l Tech Partners Conf
November 15
Investigating Electrical Properties at the Nanoscale Using AFM
January 12-15, 2014
Industry Strategy Symposium (ISS) US

- Acct Support Boot Camp
- Supply Chain Mgmt
- Financial Boot Camp

November 20
SEMI Malaysia Forum
December 4-6
January 21-22, 2014
European 3D TSV Summit

2nd Call for Papers
ASMC 2014
Due: November 14


Pervasive Computing: Are You Ready?

Karen SavalaPervasive computing is changing the landscape of the microelectronics industry, fragmenting the future of both Moore's Law and More-than-Moore technologies. At the leading edge, we have FinFETs versus FD-SOI; in memory, every roadmap involves novel devices and novel material sets; in 3D stacking, we have foundries, OSATs and IDMs developing alternative paths. In markets, the smart phone and tablet boom is moderating, China and India are cooling, but new markets, such as the all-connected Internet of Things, have the potential to create an entire new ecosystem of buyers, technologies and business models.

Pervasive Computing will be the theme for this year's Industry Strategy Symposium (ISS) held on January 12-14, 2014 in Half Moon Bay, California. You will want to register early to take advantage of discount pricing and ensure yourself a seat and what is sure to be a sold-out event. (more)

Karen Savala

ISS US 2014

Packaging Materials Trends -- Mobility is the Key Market Driver
By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI

The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials. As these trends continue, innovative material solutions will be needed to address demanding requirements related to product integration, mobility, and reliability.

Memory Materials Revolution Highlighted at SMC
By Tom Morrow, SEMI

While the number of materials used in semiconductor logic will increase approximately 50% in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced.
Related: SMC Keynote PPT--Gregg Bartlett, GlobalFoundries
Related: SEMI Members only--15+ SMC Keynotes/PPTs

SEMI Testifies at House Manufacturing Caucus
SEMI testified at the U.S. House of Representatives' Manufacturing Caucus and provided remarks at an October 29 briefing to examine manufacturing innovation in the United States.

Complimentary Webinar: 3D TSV Without Limits
Monday, November 18 / 4pm CET, 3pm GMT
Join us for this informative webinar about 3D TSV technologies, presenting mid to long term perspectives.

3D-IC Standardization Progress Continues
By James Amano, SEMI International Standards

SEMI has two new 3D-IC standards: Guide for CMP and Micro-Bump Processes for Frontside TSV Integration and Guide for Alignment Mark for 3DS-IC Process. Now there are seven published SEMI 3D standards.

450 Central Features 10+ New 450 Presentations
450 Central features 10+ new 450 presentations (including AMAT, CNSE, ENIAC, Fraunhofer, G450C, Intel) from SEMICON Europa plus many 450 articles.

Benedetto Vigna of STMicroelectronics Honored with European SEMI Award 2013
Benedetto Vigna, EVP and GM at STMicroelectronics, was presented with the European SEMI Award 2013 on October 8 during SEMICON Europa 2013.

SEMICON Korea 2014 LED Korea 2014

450mm Update on SEMI Standards--Oct 2013
Thirteen SEMI Standards task forces are working on key 450mm issues. SEMI has 19 450mm standards with 14+ in the pipeline.

Top Executives Gather at SEMICON Japan: Focus on Technologies, Business and the Future
The semiconductor industry and its supply chain are facing technical and business challenges today.

SEMI Forms New Working Group -- Focus on Semi Components, Instruments, and Subsystems
Representatives from SEMI member companies met and formed a Special Interest Group focused on common issues of components, instruments, and subsystem companies.
To participate in the SCIS survey, please click here.

SEMI Market Data Makes a Difference
Market research reports help guide important investment and strategic decisions. Learn more... 450mm Central

Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Deborah Geiger
Content Manager, SEMI
3081 Zanker Road, San Jose, California, 95134
Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email:

Subscribe ¦ Unsubscribe

Copyright © 2013 SEMI. All rights reserved.