SEMI® Global Update - February 2013
What is Europe's Industry Strategic Direction? Debate Coming Up Soon at ISS Europe

China Semiconductor Packaging Market Outlook 2012/2013

New Edition: International Technology Roadmap for PV

3D TSVs Come of Age

Member Insight: Developments in Advanced Packaging Lithography

Taiwan: Aggressive Investments in Equipment for 2013-2014

Award Winners:
- SEMI Award
- SEMI Sales & Marketing Award

SEMI and U.S. PVMC Sign MOU -- PV Standards and Roadmap Focus

LED Technology and Market Challenges Addressed in Taiwan

High-Skilled Immigration Reform: Renewed Debate

Event Calendar


February 24-26
ISS Europe

March 10-12
7th PV Fab Managers Forum 2013

March 12-13
Europe PV Standards Meetings at PV Fab Managers Forum

March 19
SEMI Europe Networking Breakfast - Printed Electronics


March 19-21
SEMICON China 2013

March 19-21
FPD China 2013

March 19-21
SOLARCON China 2013


March 20
SEMI Northeast Forum

March 31-April 4
North America Standards Spring Meetings

May 13-16
ASMC 2013

- Fund of Prod Mktg
- Acct Support Boot Camp
- Fundamentals of Yield
- Thin-Film PV Reliability
- Financial Boot Camp:
  -Finance/Acctg Concepts
  -Business Modeling
  -Pricing and Costing
  -Profitability Modeling

CS International


What is Europe's Industry Strategic Direction? Debate Coming Up Soon at ISS Europe

Heinz Kundert, SEMI Europe PresidentTop semiconductor executives from leading device, equipment and materials manufacturer as well as representatives from the European Union will debate the strategic direction of Europe's semiconductor landscape at the Industry Strategy Symposium Europe which takes place from February 24-26 near Milano. ISS 2013 will focus on three key European challenges:
  • Will Europe's semiconductor industry find a common strategy to keep pace with other regions with regard to "More Moore" and "More than Moore" manufacturing?
  • What are the critical technologies, new materials and productivity gains needed to keep the industry viable?
  • What are the market drivers in 2013 (and beyond) and what will the semiconductor landscape look like? (more)
Heinz Kundert


Semiconductor Today's latest digital issue is now available to view free of charge at: To subscribe click here.

China Semiconductor Packaging Market Outlook 2012/2013
By Yuri Cai, Industry Research & Statistics, SEMI China

Packaging and assembly are key segments of the growing semiconductor supply chain in China with over 200 companies competing in the space.

New Edition of the Int'l Technology Roadmap for PV at PV Fab Managers Forum
New edition of the ITRPV: available at the PV Fab Managers Forum on March 10-12.

3D TSVs Come of Age
By Francoise von Trapp, 3D InCites

The European 3D TSV Summit was packed with quality presentations demonstrating recent progress by the semiconductor manufacturing community.
Related Article: 3D TSV: Focus on Cost of Ownership

ISS Europe 2013

Ardy JohnsonDevelopments in Advanced Packaging Lithography: Q&A with Rudolph Technologies
Rudolph's marketing vice president, Ardy Johnson, answers SEMI questions about recent developments in advanced packaging lithography and explains the company's strategy in entering the market.

Taiwan: Aggressive Investments in Equipment for 2013-2014
Worldwide sales of new semiconductor manufacturing equipment reached $38.2 billion in 2012 according to the year-end SEMI Semiconductor Equipment Consensus Forecast.

Honored with 2012 SEMI Awards
SEMI Award: Intel team for the High-k Solution
SEMI Sales and Marketing Excellence Award: JC Kim

CS International

SEMI and the U.S. PV Manufacturing Consortium (PVMC) signed an MOU to enhance cooperation in the areas of standards and roadmap activities.

LED Technology and Market Challenges Addressed in Taiwan
With increasing awareness of global climate change and the importance of energy conservation, more and more countries have launched LED lighting projects and subsidy policies.

High-Skilled Immigration Reform Debate
President Obama pushes for comprehensive immigration reform, as well as a Senate bipartisan framework for legislation.

ASMC 2013 450mm Central

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