SEMI® Global Update - June 2014
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SEMI Global Update
Two Years of Strengthening Recovery
SEMICON West: Chip-to-Chip Optical Connections
Taiwan in 2014: Largest Region for Fab Equipment Spending
Down to 5nm: Scaling -- Performance, Cost
GaN-on-Silicon Power Devices -- Packaging Key to LED Market
SEMI Welcomes New Leader of SEMI Japan
Test Issues Up for Debate: Test Vision 2020
3D-IC Standards at SEMICON Singapore
Standards Preview for SEMICON West 2014

Event Calendar

June 17-19
Display Taiwan
September 3-5
June 3
SEMI Brussels Forum
June 4-6
Intersolar Europe

June 25
Northeast Tech Talk
July 7-10
NA Standards Mtgs at SEMICON West
July 8-10
Intersolar North America
- Supply Chain Mgmt.

Call for Nominations
SEMI Award for NA
Deadline: August 30


Controlled Environment

Recovery: Fab Equipment Spending: 24% Increase in 2014, Possible Record in 2015
By Christian Gregor Dieseldorff, Industry Research & Statistics, SEMI
According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

Chip-to-Chip Optical Connections Get Close to Market

By Paula Doe, SEMI
The demand for bandwidth is driving telecomm and data center user interest in moving high-speed optical connections closer to the chips; recent advances in packaging technology now make it possible.

Taiwan in 2014: Largest Region for Fab Equipment Spending with over US$ 10.3B

According to the May 2014 World Fab Forecast publication, the three largest regions in 2014 for fab equipment spending will be Taiwan with over US$10.3 billion, the Americas with over US$6.8 billion, and Korea with over US$6.3 billion. In 2015, these same regions will lead in spending, including Taiwan spending over US$11 billion.

Particle Measuring Sys

Down to 5nm: Scaling with the Usual Suspects: Performance, Cost
By Debra Vogler, SEMI
The semiconductor industry never lacks for controversy as it forges ahead. Lithography is always a challenge and while there may be a non-EUV roadmap to 7nm, what will happen by 5nm is not clear.

GaN-on-Silicon Power Devices Ship -- Innovation in Packaging Key to Adoption beyond LED Market

By Paula Doe, SEMI
As sales of compound semiconductor devices other than LEDs look to pass $2 billion by 2020, SEMICON West looks at volume manufacturing technology issues for these RF and power devices.

Solid State Technology=Electronics Manufacturing
Solid State Technology is a trusted source of technology, product and market insights and news that has served influential semiconductor manufacturing and packaging professionals since 1958. Visit

Osama Nakamura: New President of SEMI Japan
SEMI announces the appointment of Osamu Nakamura to the position of president of SEMI Japan effective July 1, 2014.

3D-IC Standards Workshop: SEMICON Singapore

By Tim Linehan, TechSearch International, Inc.
SEMICON Singapore 2014 featured a workshop about SEMI 3D IC Standards to determine local needs for standardization for 3D integration activities.

SEMICON Taiwan 2014

Test Issues Up for Debate: Test Vision 2020

Test Vision 2020 at SEMICON West will feature speakers from Qualcomm, Gartner, AMD, Mentor Graphics, and GLOBALFOUNDRIES, along with speakers from semiconductor test industry suppliers.

Standards Preview for SEMICON West 2014

At SEMICON West, SEMI International Standards will host SEMI North America Standards meetings, workshops and other standards-related activities.

450 Central--for Wafer Transition Information

450 Central helps keep the industry informed of important news and perspectives on 450mm.
Related: 450mm Technology Development Update Session at SEMICON West 450mm Central

Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Deborah Geiger
Content Manager, SEMI
Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email: