From 3D technologies to Heterogeneous Integration and
High-Density Systems for different applications

SAVE THE DATE
27-29 January 2020
Dresden, Germany

Platinum Sponsor

3D & Systems Summit ● 28-30 Jan 2019 ● Dresden, Germany

We Thank Our

Exhibitors, Attendees,
Sponsors, Partners
and Committees

for a Great Summit 2019

Photo Gallery here

Video here

The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1^st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors.

2019 MAIN TOPICS & HIGHLIGHTS

3DIC Through-Silicon-Via (TSV) technology
2.5D, 3D FO-WLP/e-WLB
Active and passive interposers
Stacked dies or stacked wafers
3D alternative technologies
5G Integration
Invited speakers and Keynotes
Exhibition area
Networking opportunities

Interested in sponsoring or exhibiting? Contact us!

Miri Käsler
Tel: +49 30 3030 8077 12
E-Mail: mkaesler@semi.org

2019 MEDIA AND ASSOCIATION PARTNERS

We thank all 2019 media and association partners for their support and promotion.

To support the 3D & Systems Summit please contact:

Serena Brischetto
Manager Marketing and Communications,
E-mail: sbrischetto@semi.org

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