From 3D technologies to Heterogeneous Integration and
3D & Systems Summit ● 28-30 Jan 2019 ● Dresden, Germany
The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors.
Registration is open, early bird pricing until January 1, 2019.
Post Event: 3D & Systems Summit attendees are also invited to join Symposium Panel Level Packaging 2019. Following the 3D & Systems Summit, the event is organized by Fraunhofer IZM, 30 January 14:00-18:00. To register for the event, please click here. More details are available here.
2019 MEDIA AND ASSOCIATION PARTNERS
We thank all 2019 media and association partners for their support and promotion.
To support the 3D & Systems Summit 2019 please contact:
Manager Marketing and Communications,
About last year summit: