3D-systems-summit

 

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From 3D technologies to Heterogeneous Integration and
High-Density Systems for different applications

  
 
 

SAVE THE DATE
27-29 January 2020
Dresden, Germany

 
 
 
 
Platinum Sponsor


                  

3D & Systems Summit ● 28-30 Jan 2019 ● Dresden, Germany


We Thank Our

Exhibitors, Attendees,
Sponsors, Partners
and Committees

for a Great Summit 2019 

  
Photo Gallery here
 
Video here
 
The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors.           
 

2019 MAIN TOPICS & HIGHLIGHTS  
  • 3DIC Through-Silicon-Via (TSV) technology 
  • 2.5D, 3D FO-WLP/e-WLB
  • Active and passive interposers
  • Stacked dies or stacked wafers 
  • 3D alternative technologies 
  • 5G Integration
  • Invited speakers and Keynotes
  • Exhibition area
  • Networking opportunities



Exhibit Now!


Interested in sponsoring or exhibiting? Contact us!

Miri Käsler
Tel: +49 30 3030 8077 12 
E-Mail:
 mkaesler@semi.org

  
 
 


2019 MEDIA AND ASSOCIATION PARTNERS
We thank all 2019 media and association partners for their support and promotion. 
 
3DInCites
ChipScaleReview
Clean Room Magazine
 
 
 
 
i-Micronews
 
 
 
 
 
 
 
 
 
 
 
To support the 3D & Systems Summit please contact:

Serena Brischetto 
Manager Marketing and Communications, 
E-mail: sbrischetto@semi.org 


Follow us @SEMIEurope 

 
 


 
 
 
 
 
 
Gold Sponsor

 
 
 
 
 
 
 
Silver Sponsors

 
SUSS Microtec
 
 
 
 
Event Sponsors

 
 
 
EVG