European-3D-Summit-2018-Sponsors

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3D & Systems Summit ● 28 - 30 Jan 2019 ● Dresden, Germany

Sponsorship 2019

 
The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications.
Be among the sponsors of the 1st edition of 3D & Systems Summit!

 

CONTACTS: 
Cassandra Melvin

Tel: +49 30 3030 8077 10 
E-Mail: cmelvin@semi.org 

Miri Käsler
Tel: +49 30 3030 8077 12 
E-Mail: mkaesler@semi.org 


 

We Thank our Sponsors!

 

Platinum Sponsor


SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and MVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high-speed RF device, power management and LED markets. SPTS is an established leader in process technologies for MEMS manufacturing with 27 of the top 30 MEMS manufacturers and all MEMS foundries as customers. SPTS has manufacturing facilities in Newport (UK),  Allentown (USA, Pennsylvania), San Jose (USA, California), and operates across 19 countries in Europe, North America and Asia-Pacific.

For more information please visit www.spts.com

Gold Sponsor


ASE is blazing new trails in device miniaturization and integration, as demanded by the ongoing transformation of electronics and lifestyles. And, so, alongside a broad portfolio of established technologies, ASE is delivering game-changing advanced packaging, System-in-Package and MEMS solutions to meet growth momentum across a broad range of end markets, such as automotive, 5G, AI, IoT, high performance computing, and more. To learn about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and,2.5D & 3D technologies, please visit: www.aseglobal.com
 

Silver Sponsors


SUSS Microtec

 

Suss MicroTec is a leading supplier of equipment and process solutions for micro structuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. 
In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and imprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service, SUSS MicroTec supports more than 8.000 installed systems worldwide.

For more information, please visit www.suss.com

  
Event Sponsor

 

Atotech 

Although our history traces a long way back, Atotech was officially founded in 1993. Today, we are a global leader in the highly complex world of plating chemicals, equipment and services for printed circuit board (PCB), package substrate and semiconductor manufacturing, as well as decorative and functional surface finishing.

Within the chemical sector, we have developed distinct capabilities in two core businesses: electronics and general metal finishing. Both of our business divisions are equipped with comprehensive experience, deep market insights and advanced solutions to address the specific needs of their respective markets. 

For more information, please visit www.atotech.com

 

Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for the lead frame, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. 

For more information, please visit www.besi.com

 


EVG

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

For more information please visit www.EVGroup.com

 

Fujifilm 

Beginning in 1934 as Japan's pioneering photographic film maker, Fujifilm has leveraged its imaging and information technology to become a global presence known for innovation in healthcare, graphic arts, optical devices, highly functional materials and other high-tech areas. From our roots as a photographic film manufacturer, we have steadily pursued innovative solutions in an increasingly broad range of fields, from imaging to medical systems.

For more information please visit www.fujifilm.com 

 

 

JSR Micro N.V., based in Leuven, Belgium, is a subsidiary of JSR Corporation, a multinational company employing over 6000 people worldwide and a leading materials supplier in a variety of technology-driven markets. JSR’s global network is headquartered in Tokyo. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are key to the present and future welfare of human society: life-sciences, energy storage, synthetic rubbers, electronic materials, display and optical materials. ‘Innovation one-on-one’ summarizes our value proposition to our customers. Through a very early and close collaboration, JSR offers its customers a competitive advantage based on leading-edge technologies, consistent high quality and balanced cost of ownership.

For more information, please visit www.jsrmicro.be

 

Kla-Tencor, a leading supplier of process control and yield management solutions, serves the semiconductor and related nanoelectronics industries with state-of-the-art inspection and metrology technologies. With a broad portfolio of application-focused technologies and expertise, KLA-Tencor helps nanoelectronics manufacturers manage yield throughout the fabrication process and respond to the challenges posed by shrinking device sizes, the transition to new production materials, new device and circuit architecture, more demanding lithography processes and new back-end packaging techniques. KLA-Tencor is headquartered in Milpitas, Calif., and has manufacturing, support and R&D facilities throughout the world.

For more information, please visit www.kla-tencor.com

 

Important deadlines and facts:

Please make sure to submit your company logo as a vector graphic (.eps or .ai format) in 4 colors (4c)
for print purposes and as an RGB image for digital applications.

  • For digital material (logo on SEMI Website, logo on marketing emails, newsletter and other digital
    material: please submit your files together with your signed sponsorship agreement form to
    increase your visibility.
  • Please provide a company description (max 800 characters incl. spaces)
  • Deadline: January 11, 2019
    Thank you for your collaboration! By delayed receipt of your files only digital options available