ISS Program 2019

 

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Leveraging European Ecosystems for Digital Innovation

 

                                                                                                           Abstracts and Biographies

AGENDA

Sunday, March 31
 
18:00
 
Networking reception                                                                                                          sponsored by 
   
Monday, April 1
   
7:45
 
Welcome Coffee                                                                                                                        sponsored by   
   
8:15
 
 
 
 
 
 
 
 
Welcome of SEMI

Ajit Manocha,
President and CEO, SEMI


Laith Altimime,
President, SEMI Europe

 

 

Session 1: Market Session
Chair:           Maurice Geraets, NXP Semiconductors; Gerd Teepe, T3-Technologies


 

8:30
The shape of things to come: Business Futures shaping the global semiconductor industry
Mark Purdy, AccentureManaging Director and Chief Economist, Accenture
8:55
Digitization of the manufacturing value chain – Leveraging Europe's strength in Industry 4.0
Michael Alexander, Partner – B2B Electronics,
Competence Center Industrial Products & Services (CC IPS), Roland Berger
 
9:20
 
SEMI Market Briefing – Industry Outlook, Fab Investments, Equipment and Materials Forecasts
Clark Tseng, Director, Industry Research & Statistics, SEMI
9:45
Financial Instruments to Unlock Digital Transformation
Harald Gruber, Head of the Digital Infrastructure, European Investment Bank (EIB)
10:10
Funding tools
Mark Nicklas, Head of Innovation Policy and Investment for Growth, DG Growth
 
10:35
 
 
Coffee Break 

 

 

 


Session 2: Value Chain & Ecosystem 
Chair:            Peter Connock, memsstar; Leonard Hobbs, MIDAS Ireland


 

11:15
Shift left - Disrupting the Current Automotive Development Process
Burkhard Huhnke, VP Automotive, Synopsis
11:40
TBA
Hans-Joerg Voegel, Manager AI, Cognitive Services & E/E Prototypes, BMW
12:05
TBA
Luca Rodeschini, Strategy office & Automotive Microcontroller Business Unit Director, 
STMicroelectronics
12:30
More than Colorful Pixels – Artificial Intelligence in Medical Imaging
Thomas Friese, Head of Data Architecture & Digital Technologies, Siemens Healthcare
12:55
What value can digitization of the electrical distribution bring to Semiconductor Fabs Managers?
Philippe Arsonneau, Senior Vice President, Strategic Customers & Segments, Schneider Electric
13:20
 

Lunch                                                                                                                                              sponsored by  

14:45
Security Solutions for Embedded Applications: From Scarcity to Glut
Pierre Girard, Security solution expert Automotive and mobility services, Gemalto
15:10
TBA 
Frits van Hout, Executive Vice-President and Chief Strategy Officer, ASML 
15:35
Dresden – a good fit to extend BOSCH SC Manufacturing network
Patrick Leinenbach, Senior Vice President of Automotive Electronics, Robert Bosch GmbH

16:00

 

Coffee Break

16:30
A High Capital Efficiency Fabless Start-Up
Loïc Lietar, CEO and Co-Founder, GreenWaves Technologies
16:55
European projects a way to encourage Private-Public Collaborative Innovation  
Oscar Chabrera, ViLynx Co-Founder & EU Manager, Unico ViLynx Inc
17:10
The Power of Collaboration in Europe from a SME Perspective
Alain Jarre, Chairman & CEO, Recif
17:25
How Does a SME Grow in the Semiconductor Industry with the Help of a Business Ecosystem? 
Christof Ruef, Managing Director, sentronics metrology GmbH
17:40
An overview of policies affecting the semiconductor supply chain and the role of SEMI in the ecosystem 
Emir Demircan, Senior Manager Advocacy and Public Policy, SEMI Europe
18:05
Noah – World’s first circular car
Cas Verstappen, PR-manager of TU/ecomotive, University of Eindhoven

18:30

 

End of the first day

19:00

 

Bus Shuttle

19:30


 

 

Gala Dinner                                                                                                       

                                                                                                                                                                             sponsored by             

   
Tuesday, April 2
   

8:00

 

Welcome Coffee

8:30

 

 

 

 

 
Panel: Leveraging Private-, Venture- and Public-Stakeholders to Expand the European Semiconductor Ecosystem

Moderator
Gerd Teepe, T3-Technologies

Panelists
Lucilla Sioli, Director AI and Digital Industry, DC connect
Ina Sebastian, Senior Director R&D&I Policy, Infineon
Harald Gruber, Head of the Digital Infrastructure, European Investment Bank (EIB)
Patrick Leinenbach, Senior Vice President of Automotive Electronics, Robert Bosch GmbH 
Alain Jarre, Chairman & CEO, RECIF


  

10:00

 

Coffee Break

10:30

 

Lucky Draw                                                                                                                              sponsored by   

 


Session 3: Disruptive Technology Issues - Where are we going?
Chair: Frank Schulte, Aixtron; Ari Komeran, Intel


 

10:45

TBD
TBA, Amazon Web Services

11:10

Macro Intelligence – A Different Approach to Improving Chip  Reliability
Mike LaTorraca, Chief Marketing Officer, Microtronic, Inc

11:35
AI At the Edge
Marcus Binning, Director of Artificial Intelligence Solutions, Cadence        
12:00
A Vision for AI and Digital Industry 
Lucilla Sioli, Director AI and Digital Industry, DC connect
12:25
BSC roadmap for HPC in Europe
Mateo Valero, Mare nostrum
12:50
Adjourn 
Peter Connock, Chair of the Committee

13:00

 

Lunch                                                                                                                                                                                                               sponsored by

 

 

 

Contact: 

Christina Fritsch
Tel: +49 30 30308077-18
E-Mail: 
cfritsch@semi.org