2019FLEX Japan / MEMS & SENSORS FORUM Overview
A global conference for intensive discussion of
FHE, MEMS & SENSORS technology and applications
May 22 - 23, 2019 Shinagawa,Tokyo
Wednesday, May 22 - Thursday, May 23, 2019
THE GRAND HALL (Shinagawa, Tokyo)
2 days conference and exhibition, reception
Printed Electronics, MEMS, Smart Textile and FHE related industry companies (materials, devices, devices, products)PhD in university / research institute, professor
- Brings together related markets and technologies including US, Europe, Asia and Japan
- 2-days event focused on FHE,MEMS & SENSORS-related fields, with sessions, exhibitions and receptions
- Opportunity for wide-ranging cross-discipline networking with executives and engineers from semiconductors, module, IoT application, including FHE,MEMS & SENSORS technology
FHE stands for Flexible Hybrid Electronics and is a technology for building the systems that combines flexible substrates based on printed electronics technology or textile with existing semiconductors and MEMS (micro electromechanical systems). In 2015, SEMI formed a strategic partnership with FlexTech Alliance and began focusing on FHE, for which the market is expected to grow. SEMI Japan began activities in Japan in 2016.
>> About FHE
2018FLEX Japan/MEMS SENSORS FORUM
2018 FLEX Japan was held at The Grand Hall on Thursday, April 19 th - 20 th Friday.
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