2018FLEX Japan JP Program Agenda 

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FHE and Printed Electronics Session

Session Keynote

Flexible OLEDs for Display and Sensor Applications

Thursday, April 19

13:05 - 13:45

Cambridge Display Technology Ltd CTO  Jeremy Burroughes

Cambridge Display Technology Ltd

Jeremy Burroughes, FRS, FREng, FIET, FInstP

One of the challenges for efficient and low voltage OLEDs is the need to use a low work function cathode material which leads to increased encapsulation requirements.  For mainstream applications such as TVs and lighting, the additional cost is acceptable.

For more price sensitive applications, such as displays for white goods and smart cards or sensor applications a method is required to mitigate this issue.  This talk will explain how this can be achieved using an air-processable electron injection layer capped with just aluminium.  This OLED technology can then be used to make a lower cost OLED displays suitable for a variety of applications, which will be discussed in this presentation.  

The Future is Flexible: How NextFlex is Taking on the Challenge

Thursday, April 19

13:45 - 14:15

Wilfried Bair Senior Engineering Manager  | NextFlex

Senior Engineering Manager

Wilfried Bair

Flexible Hybrid Electronics (FHE) technologies promise to enable wearable devices to be manufactured with high performance and in unobtrusive form factors for a wide variety of military and civilian applications. NextFlex, the Manufacturing USA institute focused on FHE, is an industry-led, collaboration-based public private partnership with the mission to facilitate technology innovation, accelerate commercialization and manufacturing workforce development, and ensure a sustainable manufacturing capability for emerging FHE-enabled products and technologies. This talk will describe the NextFlex community’s view of FHE opportunities, progress to date on FHE technology roadmaps, and capabilities now on line at the NextFlex Technology Hub. Successful widespread deployment of wearable technologies requires both software (algorithm, analytics, etc.) and hardware development (e.g. form factor, manufacturing). Specific examples of NextFlex projects and technologies for IOT applications in medical, industrial, and consumer electronics will be presented.

Flexible, Writeable Electrophoretic e-Paper

Thursday, April 19

14:15 - 14:45

McCreary Michael D. | E Ink Corporation Chief Technology Officer Vice Presiden

E Ink Corporation

Michael McCreary 

New generations of flexible monochrome and color electrophoretic displays (EPD) are already enabling a wide variety of applications from wearables to luggage tags to signage and shelf labels.  This presentation will describe how EPD technology is now also enabling the launch of new generations of large and smaller format writeable electrionic paper.

Flexible Roll-to-Roll Printed Hybrid Electronics Technology and Applications 

Thursday, April 19

14:45 - 15:15

写真:VTT Technical Research Centre of Finland  Harri Kopola

VTT Technical Research Centre of Finland
Knowledge Intensive Products and Services

Harri Kopola

Flexible printed hybrid electronics is an enabling technology and  is of high interest to industries asking for flex enabled, large area or wearable products and solutions.  Roll-to-roll  FHE technology status will be introduced covering  ‘flexible substrate’ processing technologies, pick and place processes to integrate/assemble  IC circuits, chips and other components on flexible substrate and further encapsulation processes to finish flexible or 3D-shaped encapsulation.   Also PrintoCent pilot lines and cluster activities for scaling-up FHE manufacturing and industrialisation will be introduced.   Finally the examples of FHE technology applications for IoT and industrial internet, digital health  and hyper-connected digital world solutions, systems and services will be described.

Low cost, conformable OLCDs on plastic – a simple, scalable manufacturing process for organic TFT-based flexible displays

Thursday, April 19

15:45 - 16:15

Simon Jones | FlexEnable Ltd Commercial Director

FlexEnable Ltd
Business Development
Commercial Director

Simon Jones

Organic LCDs (OLCDs) bring a unique set of attributes to flexible displays not possible with other flexible display technologies, including large area scalability, low cost, and high brightness with long lifetime. Such attributes are necessary to serve markets such as automotive, consumer electronics, home appliances, and digital signage. We report on the breakthrough performance of OTFT that allows OLCD to be industrialised and brought into products today.

Micro-device fab: Flexible hybrid electronics integration and standardisation for printed electronics and OLED 

Thursday, April 19

16:15 - 16:45

DoMicro BV Managing Director  Marcel Grooten

DoMicro BV
Director of Technology

Matthijs van Kooten

DoMicro BV presents a state-of-the-art Electronic Manufacturing Solution for R&D and industrialisation. The Micro Device FAB enables freely programmable process routing and sequencing. Processes can included wet chemistry, micro plasma, vacuum deposition, laser, pick & place, die bonding, multifunctional inkjet printing and (photonic) curing processes. The Micro Device FAB can also be configured as an automated LAB to perform process R&D. Pilot series and small production runs can be scheduled, achieving speed in development. Reproducibility and shortest time to market are key features bringing innovation in flexible hybrid electronics from idea to industrialization.

Smart Data Session


Thursday, April 19

16:45 - 17:15

株式会社エスクワイヤー シニアコンサルタント 金谷 敏尊 


金谷 敏尊

IoTをはじめとするスマートテクノロジーはあらゆる産業に影響を与え、多くの企業にビジネスシフトを促しています。 特に製造業では、プロセスイノベーションだけでなく、Product as a Serviceといったサービスイノベーションの例も見られます。 本セッションでは、このようなデジタライゼーションやサービタイゼーションの波に対して企業がどう取り組むべきか、そのアプローチについて提言します。

Software business models for FHE vendors

Thursday, April 19

17:15 - 17:45

写真:Jam Khan

Gemalto N.V.
Vice President of Marketing for Software Monetization

Jam Khan

Flexible hybrid electronics are finding their way into a number of consumer and industrial products due to their usefulness in enabling new capabilities and features. As hardware continues to get commoditized, applying software-centric business models allow vendors to extract the highest amount of value from FHE enabled products. This session explores concepts around how to prevent commodotization and emphasizes the value in the software ecosystems around FHE.

Smart Textile Session

Session Keynote

Smart Textile Wearable Technology Developments in EU

Friday, April 20

 9:30 - 10:10

The University of Manchester Chair of Textile Science and Engineering  Henry Yi LI

The University of Manchester
Chair of Textile Science and Engineering

Henry Yi LI

In this presentation, the development of smart textile wearable technologies in EU has been reviewed, together with introduction of relevant initiatives in the University of Manchester. The relevant research projects in the university and in collaboration with many EU partners are introduced.  The key challenges are identified and key initiatives in different regions are reviewed and discussed to reveal the potential opportunities and strategic developments of future textile wearables and standards.


Friday, April 20

10:10 - 10:40

東洋紡株式会社 総合研究所 

前田 郷司



Friday, April 20

10:40 - 11:10

住江織物株式会社 技術・生産本部 テクニカルセンター  杉野 和義 

技術・生産本部 テクニカルセンター 開発部 

杉野 和義

近年、震災等の自然災害時における電力需給の問題や周辺環境保護の観点からエネルギーハーベスティングへの関心が高まっている。我々は有機薄膜太陽電池を繊維状基材上に作製することで、軽量かつ柔軟な太陽電池を開発した。この繊維型太陽電池を布の中に織り込むことにより通気性を有した布型の太陽電池とすることができる。 また、ナノファイバー技術の応用によるウェアラブル生体情報計測分野で活用できる布型電極の開発も行っている。


Friday, April 20

11:10 - 11:40

株式会社Xenoma Co-Founder & 代表取締役CEO  網盛 一郎

Co-Founder & 代表取締役CEO

網盛 一郎


Exbitors Session

Friday, April 20

13:50 - 13:50


久保田 一弘 

半導体電子技術研究所 第2研究部 第1研究室



峰 由布子

MEMS and Sensor Session

Session Keynote

iNEMI Technology Roadmap on MEMS/Sensors 

Friday, April 20

13:50 - 14:30

International Electronics Manufacturing Initiative Managing Director for Asia Pacific  Haley Fu

International Electronics Manufacturing Initiative
Managing Director for Asia Pacific

Haley Fu

The iNEMI MEMS/Sensors TWG (technology working group) was established in 2010 and published its first roadmap in 2011. This group primarily works with the MEMS and Sensors Industry Group’s (MSIG) member companies as well as other interested contributors (industrial as well as academic). The effort was motivated by a 2009 MSIG Workshop on Testing Needs for sensors manufacturers. We also work with standards organizations (IEEE, SEMI) and in the past with the ITRS. The challenge of roadmapping MEMS/Sensors compared to semiconductors is in its great diversity of devices, applications, and manufacturing methods. This presentation will introduce the MEMS/Sensors roadmap development, from earlier iterations focused on consumer portable device technologies to recent move to Automotives, Internet of Things (IoT) and Trillion Sensors (TSensors).  This talk will discuss the market trend, the technology needs on standards, testing and packaging, based on the 2017 edition of the iNEMI roadmap, and will overview Hybrid Flexible Electronics requirements which will be discussed in the 2019 roadmap edition.  


Friday, April 20

14:30 - 15:00

東北大学 大学院工学研究科 ロボティクス専攻 博士(工学) 教授   田中 秀治

ロボティクス専攻 博士(工学)

田中 秀治



Friday, April 20

15:30 - 16:00



成田 高世

  • クリエイション・テクノロジー・ブランディング・マーケティングの4つの軸を融合させ、革新的なブランドを創出する「ブランド開発カンパニー」としての事業戦略の紹介
  • 自社開発のみならず、大学との産官学の共同研究や、他企業との共同開発に取り組んでいるインキュベーション事例の紹介


Friday, April 20

16:00 - 16:30

国立研究開発法人 産業技術総合研究所 集積マイクロシステム研究センター(UMEMSME) 社会実装化センサシステム研究チーム  竹井 裕介

国立研究開発法人 産業技術総合研究所

竹井 裕介


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