SMC Korea-Agenda

 

 

 

Agenda

 

09:00-09:05Welcome
  
09:05-09:35Keynote 1. Advanced Transistor Evolution – Technologies for 5 nm and Beyond
 Naomi Yoshida, Applied Materials
  
09:35-10:05Keynote 2. Advanced Semiconductor Materials for Next-Generation Challenges
 George Barclay, DuPont Electronics & Imaging
  
10:05-10:35Keynote 3. EUV Patterning Challenges and Opportunities
 Frédéric Lazzarino, imec
  
10:35-10:55Break
  
Session 1: Advanced Materials
  
10:55-11:25Wet-chemical Process Challenges for Advanced Logic Device Fabrication
 Dennis van Dorp, imec
  
11:25-11:55Study of Removal Rate Control in Ruthenium CMP
 Yugo Tai, JSR
  
11:55-12:25Trends of Wafer Technology
 Sungpyo Jung, SK Siltron
  
12:25-13:30Lunch
  
13:30-14:00Enabling Incoming Material Defectivity Qualification with Un-Patterned Wafer Inspection
 Ming Feng Li, KLA
  
14:00-14:30Future of Quality in CMP Slurries
 Laura Matz, Versum Materials
  
14:30-14:50Break
  
Session 2: Quality Control
 
14:50-15:20How the Materials Ecosystem Influences Semiconductor Manufacturing Performance
 Yohan Ahn, Entegris
  
15:20-15:50Start-up Performance and Pattern Defectivity Improvement Using 2 nm Rated Nylon Filter Developed with Lithography Filtration Expertise
 Seung Jin Baek, Pall
  
15:50-16:20Advanced Metrology for Measuring Contamination and Managing Risk in Semiconductor Manufacturing
 Dan Rodier, Particle Measuring System(PMS)
  
16:20-16:40Break
  
Session 3: Collaboration
 
16:40-17:10The Future of the Material Quality in Memory Volume Production
 Sueryeon Kim, Samsung Electronics
  
17:10-17:40Material Management for the Advanced Semiconductor
 Dongjun Lee, SK hynix
  
17:40-18:30Networking Reception
 
*The agenda will be subject to change without notice.
*After conference, it is available to download the presentation files, which are agreed by speaker.
 
 

CONTACT