|SEMI® Global Update - October 2014|
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|IN THIS ISSUE||
FROM THE SEMI EUROPE PRESIDENT
SEMICON Europa 2014: New Platform - Increased Spectrum of Opportunities
Plan to participate in the upcoming new and exciting SEMICON Europa, which will be held October 7 -9 in Grenoble, France. Network with your customers, suppliers, partners, and peers - and learn about the latest innovative technologies, applications and business opportunities within the European community.
In addition to its core equipment and materials sector, SEMICON Europa 2014 will also feature specific horizontal and vertical markets, including: electronic systems, components, applications, design, and much more... (more)
SEMICON Europa's Innovation Village to Feature 35 Major European Start-Ups
The new three-day Innovation Village program will be the stage for emerging innovators, industry leaders, strategic investors, and venture capitalists to discuss the needs of the industry's innovation engine.
Multi-patterning Challenges: The Future Calls for Fab-Wide Patterning Process Control
By Brian Trafas, CMO, KLA-Tencor Corporation
The semiconductor industry has moved to innovative technologies such as multiple patterning and spacer pitch splitting to overcome the resolution barrier of 193nm immersion lithography. These techniques are increasingly being used due to the delays in the availability of EUV scanners, which are now being considered for 7nm design node use.
Investments in Hardware Start-ups Signals Shift from Research to HVM for Plastic Electronics
The market for printed electronics is estimated to reach $40 billion (€32 billion) by 2020, with significant cost-savings possible from high-volumes and additive layering.
Worldwide PV Manufacturing Equipment Billings and Bookings for Q2 2014
Worldwide billings increased to $319 million in Q2 2014, an increase of 33 percent from the prior quarter but 11 percent below the same quarter a year ago.
European 3D TSV Summit to Focus on System Integration, Technology Advancements and Business Strategy
Disruptive TSV technology is now transitioning to the commercialization stage and delivering higher performance, lower power consumption and reduced footprint products to enable overall smarter system integration.
Electrostatic Discharge in Semiconductor Fabrication: Causes and Solutions
By K. Beekmann, Precision Polymer Engineering
As semiconductor technology has progressed, the industry has seen reduced voltage tolerances and a lower capacity for heat dissipation, leading to new problems and vulnerability allied to electrostatic discharge.
SEMI Members Bring Message of Supply Chain Strength to Washington, DC
SEMI members met the lawmakers who supported the passage of the Revitalize American Manufacturing & Innovation Act, pushed for extension and permanence of the R&D tax credit, Trade Promotion Authority, and funding for Science, Technology, Engineering, & Mathematics.
Vietnam Semiconductor Strategy Summit Showcases Growing Momentum
Delegates representing Vietnamese government, academia, research, and industry explored and discussed the key strategies and opportunities in the growing Vietnam semiconductor industry.
Will IoT Revolution be a Tailwind for the Japanese Semiconductor Industry?
By Osamu Nakamura, President, SEMI Japan
With the large installed fab capacity and the product mix diversity, Japan will be a region with great opportunities in the age of IoT with its increased demands for legacy technologies and high-mix low-volume production.
SEMI China Wearable Device Committee Hosts Workshop and Smart Wearable Devices Conference
By SEMI China
The workshop covered the wearable devices supply chain from component manufacturing to the end product and featured established and start-up companies.
Call for Papers
China Semiconductor International Conference (CSTIC) 2015
Abstract Due: October 22
SEMI Advanced Semiconductor Manufacturing Conference (ASMC) 2015
Abstract Due: October 31
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